Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10985080 | Electronic package that includes lamination layer | Pramod Malatkar, Kyle Yazzie, Richard J. Harries, Dilan Seneviratne, Praneeth Akkinepally +3 more | 2021-04-20 |
| 10957656 | Integrated circuit packages with patterned protective material | Kyle Yazzie, Pramod Malatkar, Chia-Pin Chiu, Mohit Mamodia, Mark Gallina +3 more | 2021-03-23 |