Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11116084 | Method, device and system for providing etched metallization structures | Nicholas S. Haehn, Oscar Ojeda, Arnab Roy, Timothy A. White, Suddhasattwa Nad +1 more | 2021-09-07 |
| 11081768 | Fabricating an RF filter on a semiconductor package using selective seeding | Brandon C. Marin, Aleksandar Aleksov, Kristof Darmawikarta, Yonggang Li, Dilan Seneviratne | 2021-08-03 |
| 10923443 | Electronic device package including a capacitor | Brandon C. Marin, Shivasubramanian Balasubramanian, Rahul Jain, Praneeth Akkinepally | 2021-02-16 |
| 10910327 | Electronic device package with reduced thickness variation | Yonggang Li, Brandon C. Marin, Vahidreza Parichehreh | 2021-02-02 |