Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081768 | Fabricating an RF filter on a semiconductor package using selective seeding | Brandon C. Marin, Jeremy Ecton, Aleksandar Aleksov, Kristof Darmawikarta, Dilan Seneviratne | 2021-08-03 |
| 10985080 | Electronic package that includes lamination layer | Pramod Malatkar, Kyle Yazzie, Naga Sivakumar Yagnamurthy, Richard J. Harries, Dilan Seneviratne +3 more | 2021-04-20 |
| 10910327 | Electronic device package with reduced thickness variation | Brandon C. Marin, Vahidreza Parichehreh, Jeremy Ecton | 2021-02-02 |