Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11177232 | Circuit device with monolayer bonding between surface structures | Rahul N. Manepalli, Marcel Wall | 2021-11-16 | $23,453,000 |
| 11177234 | Package architecture with improved via drill process and method for forming such package | Rahul N. Manepalli, Marcel Wall | 2021-11-16 | $23,453,000 |
| 11116084 | Method, device and system for providing etched metallization structures | Jeremy Ecton, Nicholas S. Haehn, Oscar Ojeda, Arnab Roy, Timothy A. White +1 more | 2021-09-07 | $31,495,000 |
| 10971416 | Package power delivery using plane and shaped vias | Krishna Bharath, Mathew J. Manusharow, Adel A. Elsherbini, Mihir K. Roy, Aleksandar Aleksov +4 more | 2021-04-06 | $36,336,000 |