Rahul N. Manepalli — 8 Patents at Intel

Issued Patents 2021

Showing 1–8 of 8 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
11177234	Package architecture with improved via drill process and method for forming such package	Suddhasattwa Nad, Marcel Wall	2021-11-16	$23,453,000
11177232	Circuit device with monolayer bonding between surface structures	Suddhasattwa Nad, Marcel Wall	2021-11-16	$23,453,000
11164818	Inorganic-based embedded-die layers for modular semiconductive devices	Srinivas V. Pietambaram, Tarek A. Ibrahim, Kristof Darmawikarta, Debendra Mallik, Robert L. Sankman	2021-11-02	$26,002,000
11158558	Package with underfill containment barrier	Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta +4 more	2021-10-26	$21,268,000
11107781	RFIC having coaxial interconnect and molded layer	Srinivas V. Pietambaram, Kristof Darmawikarta, Robert Alan May, Aleksandar Aleksov, Telesphor Kamgaing	2021-08-31	$22,590,000
11081448	Embedded die microelectronic device with molded component	Srinivas V. Pietambaram, Praneeth Akkinepally, Jesse C. Jones, Yosuke Kanaoka, Dilan Seneviratne	2021-08-03	$25,424,000
11062933	Die placement and coupling apparatus	Jesse C. Jones, Gang Duan, Yosuke Kanaoka	2021-07-13	$34,958,000
10892219	Molded embedded bridge for enhanced EMIB applications	Srinivas V. Pietambaram	2021-01-12	$55,416,000