Issued Patents 2021
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177234 | Package architecture with improved via drill process and method for forming such package | Suddhasattwa Nad, Marcel Wall | 2021-11-16 |
| 11177232 | Circuit device with monolayer bonding between surface structures | Suddhasattwa Nad, Marcel Wall | 2021-11-16 |
| 11164818 | Inorganic-based embedded-die layers for modular semiconductive devices | Srinivas V. Pietambaram, Tarek A. Ibrahim, Kristof Darmawikarta, Debendra Mallik, Robert L. Sankman | 2021-11-02 |
| 11158558 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta +4 more | 2021-10-26 |
| 11107781 | RFIC having coaxial interconnect and molded layer | Srinivas V. Pietambaram, Kristof Darmawikarta, Robert Alan May, Aleksandar Aleksov, Telesphor Kamgaing | 2021-08-31 |
| 11081448 | Embedded die microelectronic device with molded component | Srinivas V. Pietambaram, Praneeth Akkinepally, Jesse C. Jones, Yosuke Kanaoka, Dilan Seneviratne | 2021-08-03 |
| 11062933 | Die placement and coupling apparatus | Jesse C. Jones, Gang Duan, Yosuke Kanaoka | 2021-07-13 |
| 10892219 | Molded embedded bridge for enhanced EMIB applications | Srinivas V. Pietambaram | 2021-01-12 |