Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081448 | Embedded die microelectronic device with molded component | Srinivas V. Pietambaram, Rahul N. Manepalli, Praneeth Akkinepally, Yosuke Kanaoka, Dilan Seneviratne | 2021-08-03 |
| 11062933 | Die placement and coupling apparatus | Gang Duan, Yosuke Kanaoka, Rahul N. Manepalli | 2021-07-13 |