Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177232 | Circuit device with monolayer bonding between surface structures | Suddhasattwa Nad, Rahul N. Manepalli | 2021-11-16 |
| 11177234 | Package architecture with improved via drill process and method for forming such package | Suddhasattwa Nad, Rahul N. Manepalli | 2021-11-16 |