Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11127682 | Semiconductor package having nonspherical filler particles | Sashi S. Kandanur, Srinivas V. Pietambaram | 2021-09-21 | $30,488,000 |
| 10998282 | Surface finishes for high density interconnect architectures | Srinivas V. Pietambaram | 2021-05-04 | $37,420,000 |