Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127682 | Semiconductor package having nonspherical filler particles | Sashi S. Kandanur, Srinivas V. Pietambaram | 2021-09-21 |
| 10998282 | Surface finishes for high density interconnect architectures | Srinivas V. Pietambaram | 2021-05-04 |