Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11205626 | Coreless organic packages with embedded die and magnetic inductor structures | Rahul Jain, Prithwish Chatterjee, Lauren A. Link, Sai Vadlamani | 2021-12-21 | $33,282,000 |
| 11189409 | Electronic substrates having embedded dielectric magnetic material to form inductors | Prithwish Chatterjee, Lauren A. Link, Sai Vadlamani | 2021-11-30 | $30,212,000 |
| D926478 | Fabric with camouflage pattern | Isaiah Friesen | 2021-08-03 | |
| 11075130 | Package substrate having polymer-derived ceramic core | Lisa Ying Ying Chen, Lauren A. Link, Robert Alan May, Amruthavalli Pallavi Alur, Kristof Darmawikarta +3 more | 2021-07-27 | $27,337,000 |
| 10916486 | Semiconductor device including silane based adhesion promoter and method of making | Chi-Mon Chen, Robert Alan May, Amanda E. Schuckman, Wei-Lun Kane Jen | 2021-02-09 | $44,388,000 |