Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11088103 | First layer interconnect first on carrier approach for EMIB patch | Changhua Liu, Xiaoying Guo, Aleksandar Aleksov, Leonel Arana, Robert Alan May +1 more | 2021-08-10 | $36,027,000 |