Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Microelectronic devices designed with foldable flexible substrates for high frequency communication modules

Microelectronic devices designed with foldable flexible substrates for high frequency communication modules

US Patent 11056765 · Granted Jul 6, 2021

Estimated economic value: $31,309,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Flexible die to floor planning with bump pitch scale through glass core via pitc2025
Packaging architecture with intermediate routing layers2025
Contactless communication using a waveguide extending through a substrate core2025
Contactless communication using a waveguide extending through a substrate core2025
Inductor and transformer semiconductor devices using hybrid bonding technology2025
High precision scalable packaging architecture based on radio frequency scanning2025
Packaging architectures for sub-terahertz radio frequency devices2025
Physical vapor deposition seeding for high aspect ratio vias in glass core techn2025
Physical vapor deposition seeding for high aspect ratio vias in glass core techn2025
Disaggregated entropy services for microelectronic assemblies2025
RF filters and multiplexers manufactured in the core of a package substrate usin2025
RF filters and multiplexers manufactured in the core of a package substrate usin2025