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Home › Semiconductor package comprising chiplets disposed on a substrate which are electromagnetically coupled by dielectric waveguides and a computing networks formed therefrom

Semiconductor package comprising chiplets disposed on a substrate which are electromagnetically coupled by dielectric waveguides and a computing networks formed therefrom

US Patent 10992017 · Granted Apr 27, 2021

Estimated economic value: $44,593,000 ⓘ

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