Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11024559 | Semiconductor package with electromagnetic interference shielding structures | Joshua D. Heppner | 2021-06-01 |
| 10910314 | Conductive coating for a microelectronics package | Li-Sheng Weng, Chung-Hao Chen, Emile Davies-Venn, Kemal Aygun | 2021-02-02 |