Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195805 | Capacitor die embedded in package substrate for providing capacitance to surface mounted die | Andrew Collins, Sujit Sharan | 2021-12-07 |
| 11114394 | Signal routing carrier | Lijiang Wang, Sujit Sharan, Robert L. Sankman | 2021-09-07 |
| 10950550 | Semiconductor package with through bridge die connections | Zhiguo Qian, Kemal Aygun | 2021-03-16 |