Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195805 | Capacitor die embedded in package substrate for providing capacitance to surface mounted die | Andrew Collins, Jianyong Xie | 2021-12-07 |
| 11114394 | Signal routing carrier | Lijiang Wang, Jianyong Xie, Robert L. Sankman | 2021-09-07 |
| 11031288 | Passive components in vias in a stacked integrated circuit package | Ravindranath V. Mahajan, Stefan Rusu, Donald S. Gardner | 2021-06-08 |
| 10978423 | Projecting contacts and method for making the same | Dae-Woo Kim, Ravindranath V. Mahajan | 2021-04-13 |
| 10923429 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz +1 more | 2021-02-16 |
| 10916514 | Metal-free frame design for silicon bridges for semiconductor packages | Dae-Woo Kim, Sairam Agraharam | 2021-02-09 |