Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195805 | Capacitor die embedded in package substrate for providing capacitance to surface mounted die | Sujit Sharan, Jianyong Xie | 2021-12-07 |
| 11018124 | Embedded memory device and method for embedding memory device in a substrate | — | 2021-05-25 |