Issued Patents 2021
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158448 | Packaging layer inductor | Alan Roth, Eric Soenen, Ying-Chih Hsu, Nick Samra | 2021-10-26 |
| 11152332 | Modular voltage regulators | Nick Samra, Alan Roth, Eric Soenen, Paul Ranucci | 2021-10-19 |
| 11151297 | Multiple fin count layout, method, system, and device | Po-Chia Lai, Ming-Chang Kuo, Jerry Chang Jui Kao, Wei Ling Chang, Wei-Ren Chen +2 more | 2021-10-19 |
| 11107931 | Structure and formation method of semiconductor device structure with nanowires | Wilman Tsai, Cheng-Hsien Wu, I-Sheng Chen | 2021-08-31 |
| 11094682 | Package structure and method of fabricating the same | Rabiul Islam, Chuei-Tang Wang, Weiwei Song | 2021-08-17 |
| 11031288 | Passive components in vias in a stacked integrated circuit package | Sujit Sharan, Ravindranath V. Mahajan, Donald S. Gardner | 2021-06-08 |
| 11025236 | Low-power AOI-based flip-flop | Po-Chia Lai, Chi-Lin Liu, Greg Gruber | 2021-06-01 |
| 10951201 | Flip flop standard cell | Nick Samra, Ta-Pen Guo | 2021-03-16 |
| 10931264 | Low-power flip flop circuit | Po-Chia Lai, Meng-Hung Shen, Chi-Lin Liu, Yan-Hao Chen, Jerry Chang Jui Kao | 2021-02-23 |
| 10930554 | Semiconductor device and method for manufacturing the same | Nick Samra | 2021-02-23 |
| 10923463 | Method and machine-readable medium for configuring processors with base dies having landing slots | — | 2021-02-16 |