Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11094633 | Bridge die design for high bandwidth memory interface | Kemal Aygun, Dae-Woo Kim, Jackie C. Preciado | 2021-08-17 | $29,127,000 |
| 11081434 | Package substrates with magnetic build-up layers | Kaladhar Radhakrishnan, Kemal Aygun | 2021-08-03 | $25,424,000 |
| 11031341 | Side mounted interconnect bridges | Md Altai Hossain, Kevin J. Doran, Yu Zhang | 2021-06-08 | $26,946,000 |
| 10950550 | Semiconductor package with through bridge die connections | Jianyong Xie, Kemal Aygun | 2021-03-16 | $38,556,000 |
| 10892225 | Die interconnect structures and methods | Kemal Aygun | 2021-01-12 | $55,416,000 |