Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145613 | Method for forming bump structure | Li-Guo Lee, Yung S. Liu, Yi-Chen Liu, Yi-Jen Lai, Hsi-Kuei Cheng | 2021-10-12 |
| 11121254 | Transistor with strained superlattice as source/drain region | Bo-Shiun Chen, Chung-Ting Huang, Chi-Hsuan Tang, Jhong-Yi Huang, Guan-Ying Wu | 2021-09-14 |
| 11062953 | Semiconductor device and method for fabricating the same | Tien-I Wu, Yu-Shu Lin | 2021-07-13 |
| 10943991 | Semiconductor device and method for fabricating the same | Wei-Chih Chuang, Chia-Jong Liu, Kuang-Hsiu Chen, Chung-Ting Huang, Chi-Hsuan Tang +7 more | 2021-03-09 |