Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201142 | Semiconductor package, package on package structure and method of froming package on package structure | Li-Hsien Huang, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Hua-Wei Tseng +2 more | 2021-12-14 |
| 11145613 | Method for forming bump structure | Li-Guo Lee, Yung S. Liu, Yi-Chen Liu, Chun-Jen Chen, Hsi-Kuei Cheng | 2021-10-12 |