Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145613 | Method for forming bump structure | Li-Guo Lee, Yung S. Liu, Yi-Chen Liu, Yi-Jen Lai, Chun-Jen Chen | 2021-10-12 |
| 11069614 | Semiconductor package structure | Chih-Kang Han, Ching Fu Chang, Hsin-Chieh Huang | 2021-07-20 |
| 10950478 | Info structure with copper pillar having reversed profile | Ching Fu Chang, Chih-Kang Han, Hsin-Chieh Huang | 2021-03-16 |