Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11069614 | Semiconductor package structure | Hsi-Kuei Cheng, Chih-Kang Han, Hsin-Chieh Huang | 2021-07-20 |
| 10950478 | Info structure with copper pillar having reversed profile | Hsi-Kuei Cheng, Chih-Kang Han, Hsin-Chieh Huang | 2021-03-16 |