Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145613 | Method for forming bump structure | Li-Guo Lee, Yi-Chen Liu, Yi-Jen Lai, Chun-Jen Chen, Hsi-Kuei Cheng | 2021-10-12 |
YL
Yung S. Liu
Overall (2021): #194,178 of 548,734Top 40%
1
Patents 2021