Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145613 | Method for forming bump structure | Yung S. Liu, Yi-Chen Liu, Yi-Jen Lai, Chun-Jen Chen, Hsi-Kuei Cheng | 2021-10-12 |
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Li-Guo Lee
Overall (2021): #360,970 of 548,734Top 70%
1
Patents 2021