Issued Patents 2021
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201142 | Semiconductor package, package on package structure and method of froming package on package structure | Li-Hsien Huang, Chen-Hua Yu, Der-Chyang Yeh, Hua-Wei Tseng, Ming-Chih Yew +2 more | 2021-12-14 |
| 11183399 | Semiconductor device and method of manufacture | Wen-Hsin Wei, Hsien-Pin Hu, Shang-Yun Hou, Chen-Hua Yu, Wen-Jung Chuang +6 more | 2021-11-23 |
| 11177238 | Semiconductor structure | Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, An-Jhih Su, Tien-Chung Yang | 2021-11-16 |
| 11164855 | Package structure with a heat dissipating element and method of manufacturing the same | Weiming Chris Chen, Chih-Wei Wu, Kuo-Chiang Ting, Szu-Wei Lu, Shang-Yun Hou +3 more | 2021-11-02 |
| 11156772 | Photonic semiconductor device and method | Chen-Hua Yu, Hsing-Kuo Hsia, Kuo-Chiang Ting, Pin-Tso Lin, Sung-Hui Huang +1 more | 2021-10-26 |
| 11158619 | Redistribution layers in semiconductor packages and methods of forming same | Li-Hsien Huang, An-Jhih Su, Chen-Hua Yu, Der-Chyang Yeh | 2021-10-26 |
| 11133258 | Package with bridge die for interconnection and method forming same | Chen-Hua Yu, An-Jhih Su, Der-Chyang Yeh, Ming-Shih Yeh, Tsung-Shu Lin | 2021-09-28 |
| 11133237 | Package with embedded heat dissipation features | Wensen Hung, Szu-Po Huang, Hsiang-Fan Lee, Kim Hong Chen, Shin-Puu Jeng | 2021-09-28 |
| 11101260 | Method of forming a dummy die of an integrated circuit having an embedded annular structure | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin +8 more | 2021-08-24 |
| 11101140 | Semiconductor device and method of manufacture | Wen-Hsin Wei, Hsien-Pin Hu, Shang-Yun Hou, Chen-Hua Yu, Wen-Jung Chuang +6 more | 2021-08-24 |
| 11088048 | Semiconductor structure | Wensen Hung, Tsung-Shu Lin, Shih-Chang Ku, Tsung-Yu Chen, Hung-Chi Li | 2021-08-10 |
| 11069625 | Method for forming package structure | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh | 2021-07-20 |
| 11062987 | Semiconductor device | Jing-Cheng Lin, Chen-Hua Yu, Po-Hao Tsai | 2021-07-13 |
| 11037852 | 3DIC packaging with hot spot thermal management features | Wensen Hung, Szu-Po Huang, Hsiang-Fan Lee, Kim Hong Chen, Shin-Puu Jeng | 2021-06-15 |
| 11018088 | Dummy features in redistribution layers (RDLS) and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh +1 more | 2021-05-25 |
| 11018069 | Underfill control structures and method | Ying-Ju Chen, An-Jhih Su, Hsien-Wei Chen, Der-Chyang Yeh, Chen-Hua Yu | 2021-05-25 |
| 11004771 | Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices | Cheng-Chieh Hsieh, Shin-Puu Jeng, Tsung-Yu Chen, Wensen Hung | 2021-05-11 |
| 10978352 | FinFET device | Joanna Chaw Yane Yin, Kuo-Chiang Ting, Kuang-Hsin Chen | 2021-04-13 |
| 10950577 | Redistribution layers in semiconductor packages and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh +1 more | 2021-03-16 |
| 10950575 | Package structure and method of forming the same | Chen-Hua Yu, Li-Hsien Huang, Der-Chyang Yeh, Hsien-Wei Chen, An-Jhih Su +1 more | 2021-03-16 |
| 10943798 | Fan-out structure and method of fabricating the same | Chen-Hua Yu, An-Jhih Su, Der-Chyang Yeh, Hsien-Wei Chen, Wei-Yu Chen | 2021-03-09 |
| 10939551 | Opening in the pad for bonding integrated passive device in InFO package | Cheng-Hsien Hsieh, Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, Li-Han Hsu +1 more | 2021-03-02 |