Issued Patents 2021
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164852 | Method of forming package structure | Jing-Cheng Lin | 2021-11-02 |
| 11164754 | Fan-out packages and methods of forming the same | Ming-Chih Yew, Chia-Kuei Hsu, Shin-Puu Jeng, Po-Yao Chuang, Meng-Liang Lin +2 more | 2021-11-02 |
| 11158587 | Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices | Jui-Pin Hung, Jing-Cheng Lin | 2021-10-26 |
| 11158588 | Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices | Jui-Pin Hung, Jing-Cheng Lin | 2021-10-26 |
| 11114405 | Semiconductor package structure with twinned copper | Jung-Hua Chang, Jing-Cheng Lin | 2021-09-07 |
| 11114313 | Wafer level mold chase | Hsien-Wen Liu, Yi-Wen Wu, Shin-Puu Jeng | 2021-09-07 |
| 11114311 | Chip package structure and method for forming the same | Shih-Ting Hung, Shin-Puu Jeng, Techi Wong | 2021-09-07 |
| 11107798 | Semiconductor packages and methods of forming the same | Chen-Hua Yu, Jing-Cheng Lin | 2021-08-31 |
| 11101214 | Package structure with dam structure and method for forming the same | Techi Wong, Meng-Liang Lin, Yi-Wen Wu, Po-Yao Chuang, Shin-Puu Jeng | 2021-08-24 |
| 11094625 | Semiconductor package with improved interposer structure | Yi-Wen Wu, Techi Wong, Po-Yao Chuang, Shih-Ting Hung, Shin-Puu Jeng | 2021-08-17 |
| 11094639 | Semiconductor package | Jing-Cheng Lin, Ying-Ching Shih, Szu-Wei Lu | 2021-08-17 |
| 11075168 | InFO-POP structures with TIVs having cavities | Jing-Cheng Lin, Chen-Hua Yu | 2021-07-27 |
| 11075151 | Fan-out package with controllable standoff | Techi Wong, Meng-Wei Chou, Meng-Liang Lin, Po-Yao Chuang, Shin-Puu Jeng | 2021-07-27 |
| 11069673 | Semiconductor package and manufacturing method thereof | Li-Hui Cheng, Jing-Cheng Lin | 2021-07-20 |
| 11063007 | Semiconductor device and method of manufacture | Po-Yao Chuang, Shin-Puu Jeng | 2021-07-13 |
| 11062997 | Method for forming chip package structure | Shin-Puu Jeng, Techi Wong, Po-Yao Lin, Ming-Chih Yew, Po-Yao Chuang | 2021-07-13 |
| 11062987 | Semiconductor device | Jing-Cheng Lin, Chi-Hsi Wu, Chen-Hua Yu | 2021-07-13 |
| 11056471 | Semiconductor device and method of manufacture | Jing-Cheng Lin, Li-Hui Cheng, Porter Chen | 2021-07-06 |
| 11037861 | Interconnect structure for package-on-package devices | Jui-Pin Hung, Jing-Cheng Lin, Yi-Jou Lin, Shuo-Mao Chen, Chiung-Han Yeh +1 more | 2021-06-15 |
| 11018081 | Heterogeneous fan-out structure and method of manufacture | Po-Yao Chuang, Shin-Puu Jeng, Techi Wong | 2021-05-25 |
| 10985100 | Chip package with recessed interposer substrate | Shin-Puu Jeng, Po-Yao Chuang, Feng-Cheng Hsu, Shuo-Mao Chen, Techi Wong | 2021-04-20 |
| 10971461 | Semiconductor device and method of manufacture | Po-Yao Chuang, Ming-Chih Yew, Shin-Puu Jeng | 2021-04-06 |
| 10937742 | Package and manufacturing method thereof | — | 2021-03-02 |