Issued Patents 2021
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205612 | Integrated circuit package and method | Chih-Chien Pan, Chin-Fu Kao, Szu-Wei Lu | 2021-12-21 |
| 11121051 | Semiconductor packages and method of manufacturing the same | Chin-Fu Kao, Szu-Wei Lu, Chih-Chien Pan | 2021-09-14 |
| 11101252 | Package-on-package structure and manufacturing method thereof | Shih-Ting Lin, Chin-Fu Kao, Jing-Cheng Lin, Szu-Wei Lu | 2021-08-24 |
| 11081369 | Package structure and manufacturing method thereof | Szu-Wei Lu, Ping-Yin Hsieh, Chih-Hao Chen | 2021-08-03 |
| 11069673 | Semiconductor package and manufacturing method thereof | Jing-Cheng Lin, Po-Hao Tsai | 2021-07-20 |
| 11062968 | Package structure and method for forming the same | Chih-Hao Chen, Chih-Chien Pan, Chin-Fu Kao, Szu-Wei Lu | 2021-07-13 |
| 11056471 | Semiconductor device and method of manufacture | Jing-Cheng Lin, Po-Hao Tsai, Porter Chen | 2021-07-06 |
| 11031381 | Optical transceiver and manufacturing method thereof | Chih-Hao Chen, Chin-Fu Kao, Szu-Wei Lu | 2021-06-08 |