Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205612 | Integrated circuit package and method | Li-Hui Cheng, Chin-Fu Kao, Szu-Wei Lu | 2021-12-21 |
| 11121051 | Semiconductor packages and method of manufacturing the same | Li-Hui Cheng, Chin-Fu Kao, Szu-Wei Lu | 2021-09-14 |
| 11062968 | Package structure and method for forming the same | Chih-Hao Chen, Li-Hui Cheng, Chin-Fu Kao, Szu-Wei Lu | 2021-07-13 |