Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114311 | Chip package structure and method for forming the same | Po-Hao Tsai, Shih-Ting Hung, Shin-Puu Jeng | 2021-09-07 |
| 11101214 | Package structure with dam structure and method for forming the same | Po-Hao Tsai, Meng-Liang Lin, Yi-Wen Wu, Po-Yao Chuang, Shin-Puu Jeng | 2021-08-24 |
| 11094625 | Semiconductor package with improved interposer structure | Yi-Wen Wu, Po-Hao Tsai, Po-Yao Chuang, Shih-Ting Hung, Shin-Puu Jeng | 2021-08-17 |
| 11075151 | Fan-out package with controllable standoff | Po-Hao Tsai, Meng-Wei Chou, Meng-Liang Lin, Po-Yao Chuang, Shin-Puu Jeng | 2021-07-27 |
| 11062997 | Method for forming chip package structure | Shin-Puu Jeng, Po-Yao Lin, Ming-Chih Yew, Po-Hao Tsai, Po-Yao Chuang | 2021-07-13 |
| 11018081 | Heterogeneous fan-out structure and method of manufacture | Po-Hao Tsai, Po-Yao Chuang, Shin-Puu Jeng | 2021-05-25 |
| 10985100 | Chip package with recessed interposer substrate | Shin-Puu Jeng, Po-Hao Tsai, Po-Yao Chuang, Feng-Cheng Hsu, Shuo-Mao Chen | 2021-04-20 |