Issued Patents 2021
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164754 | Fan-out packages and methods of forming the same | Po-Hao Tsai, Ming-Chih Yew, Chia-Kuei Hsu, Shin-Puu Jeng, Meng-Liang Lin +2 more | 2021-11-02 |
| 11101214 | Package structure with dam structure and method for forming the same | Po-Hao Tsai, Techi Wong, Meng-Liang Lin, Yi-Wen Wu, Shin-Puu Jeng | 2021-08-24 |
| 11094625 | Semiconductor package with improved interposer structure | Yi-Wen Wu, Techi Wong, Po-Hao Tsai, Shih-Ting Hung, Shin-Puu Jeng | 2021-08-17 |
| 11075132 | Integrated fan-out package, package-on-package structure, and manufacturing method thereof | Shin-Puu Jeng, Hsien-Wen Liu, Shih-Ting Hung, Yi-Jou Lin, Tzu-Jui Fang | 2021-07-27 |
| 11075151 | Fan-out package with controllable standoff | Po-Hao Tsai, Techi Wong, Meng-Wei Chou, Meng-Liang Lin, Shin-Puu Jeng | 2021-07-27 |
| 11062997 | Method for forming chip package structure | Shin-Puu Jeng, Techi Wong, Po-Yao Lin, Ming-Chih Yew, Po-Hao Tsai | 2021-07-13 |
| 11063007 | Semiconductor device and method of manufacture | Po-Hao Tsai, Shin-Puu Jeng | 2021-07-13 |
| 11018081 | Heterogeneous fan-out structure and method of manufacture | Po-Hao Tsai, Shin-Puu Jeng, Techi Wong | 2021-05-25 |
| 10985100 | Chip package with recessed interposer substrate | Shin-Puu Jeng, Po-Hao Tsai, Feng-Cheng Hsu, Shuo-Mao Chen, Techi Wong | 2021-04-20 |
| 10971461 | Semiconductor device and method of manufacture | Po-Hao Tsai, Ming-Chih Yew, Shin-Puu Jeng | 2021-04-06 |