Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11075132 | Integrated fan-out package, package-on-package structure, and manufacturing method thereof | Shin-Puu Jeng, Hsien-Wen Liu, Shih-Ting Hung, Yi-Jou Lin, Po-Yao Chuang | 2021-07-27 |