Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11037861 | Interconnect structure for package-on-package devices | Jui-Pin Hung, Jing-Cheng Lin, Po-Hao Tsai, Yi-Jou Lin, Shuo-Mao Chen +1 more | 2021-06-15 |
| 11018241 | Polysilicon design for replacement gate technology | Harry-Hak-Lay Chuang, Kong-Beng Thei, Sheng-Chen Chung, Lee-Wee Teo, Yu-Ying Hsu +1 more | 2021-05-25 |
| 10971441 | Package with metal-insulator-metal capacitor and method of manufacturing the same | Shuo-Mao Chen, Der-Chyang Yeh | 2021-04-06 |