Issued Patents 2021
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164836 | Film scheme for bumping | Yao-Wen Chang, Chern-Yow Hsu, Cheng-Yuan Tsai | 2021-11-02 |
| 11133226 | FUSI gated device formation | Yi-Huan Chen, Chien-Chih Chou, Ta-Wei Lin, Hsiao-Chin Tuan, Alexander Kalnitsky +1 more | 2021-09-28 |
| 11121038 | Spacer structure and manufacturing method thereof | Alexander Kalnitsky | 2021-09-14 |
| 11063038 | Through silicon via design for stacking integrated circuits | Dun-Nian Yaung, Fu-Jier Fan, Hsing-Chih Lin, Hsiao-Chin Tuan, Jen-Cheng Liu +2 more | 2021-07-13 |
| 11018241 | Polysilicon design for replacement gate technology | Harry-Hak-Lay Chuang, Sheng-Chen Chung, Chiung-Han Yeh, Lee-Wee Teo, Yu-Ying Hsu +1 more | 2021-05-25 |
| 11011619 | Method and related apparatus for reducing gate-induced drain leakage in semiconductor devices | Chien-Chih Chou, Hsiao-Chin Tuan, Yi-Huan Chen, Alexander Kalnitsky | 2021-05-18 |
| 11004844 | Recessed STI as the gate dielectric of HV device | Yi-Huan Chen, Fu-Jier Fan, Ker Hsiao Huo, Kau-Chu Lin, Li-Hsuan Yeh +2 more | 2021-05-11 |
| 10991693 | Boundary region for high-k-metal-gate (HKMG) integration technology | Yi-Huan Chen, Chien-Chih Chou | 2021-04-27 |
| 10964692 | Through silicon via design for stacking integrated circuits | Dun-Nian Yaung, Fu-Jier Fan, Hsing-Chih Lin, Hsiao-Chin Tuan, Jen-Cheng Liu +2 more | 2021-03-30 |
| 10950708 | Dishing prevention dummy structures for semiconductor devices | Yi-Huan Chen, Chien-Chih Chou, Ta-Wei Lin, Fu-Jier Fan, Yi-Sheng Chen +1 more | 2021-03-16 |
| 10937891 | Spacer structure and manufacturing method thereof | Fu-Jier Fan, Szu-Hsien Liu | 2021-03-02 |
| 10937785 | Semiconductor device | Yi-Sheng Chen, Fu-Jier Fan, Jung-Hui Kao, Yi-Huan Chen, Kau-Chu Lin | 2021-03-02 |
| 10930776 | High voltage LDMOS transistor and methods for manufacturing the same | Ker Hsiao Huo, Chien-Chih Chou, Yi-Min Chen, Chen-Liang Chu | 2021-02-23 |
| 10916542 | Recessed STI as the gate dielectric of HV device | Yi-Huan Chen, Fu-Jier Fan, Ker Hsiao Huo, Kau-Chu Lin, Li-Hsuan Yeh +2 more | 2021-02-09 |