Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11063038 | Through silicon via design for stacking integrated circuits | Kong-Beng Thei, Dun-Nian Yaung, Hsing-Chih Lin, Hsiao-Chin Tuan, Jen-Cheng Liu +2 more | 2021-07-13 |
| 11004844 | Recessed STI as the gate dielectric of HV device | Yi-Huan Chen, Kong-Beng Thei, Ker Hsiao Huo, Kau-Chu Lin, Li-Hsuan Yeh +2 more | 2021-05-11 |
| 10964692 | Through silicon via design for stacking integrated circuits | Kong-Beng Thei, Dun-Nian Yaung, Hsing-Chih Lin, Hsiao-Chin Tuan, Jen-Cheng Liu +2 more | 2021-03-30 |
| 10950708 | Dishing prevention dummy structures for semiconductor devices | Yi-Huan Chen, Chien-Chih Chou, Ta-Wei Lin, Kong-Beng Thei, Yi-Sheng Chen +1 more | 2021-03-16 |
| 10937891 | Spacer structure and manufacturing method thereof | Kong-Beng Thei, Szu-Hsien Liu | 2021-03-02 |
| 10937785 | Semiconductor device | Yi-Sheng Chen, Kong-Beng Thei, Jung-Hui Kao, Yi-Huan Chen, Kau-Chu Lin | 2021-03-02 |
| 10916542 | Recessed STI as the gate dielectric of HV device | Yi-Huan Chen, Kong-Beng Thei, Ker Hsiao Huo, Kau-Chu Lin, Li-Hsuan Yeh +2 more | 2021-02-09 |