Issued Patents 2021
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11063038 | Through silicon via design for stacking integrated circuits | Kong-Beng Thei, Dun-Nian Yaung, Fu-Jier Fan, Hsing-Chih Lin, Hsiao-Chin Tuan +2 more | 2021-07-13 |
| D922499 | 3D puzzle toy | — | 2021-06-15 |
| D922500 | 3D puzzle toy | — | 2021-06-15 |
| D921768 | 3D puzzle toy | — | 2021-06-08 |
| D921769 | 3D puzzle toy | — | 2021-06-08 |
| 11004844 | Recessed STI as the gate dielectric of HV device | Yi-Huan Chen, Kong-Beng Thei, Fu-Jier Fan, Ker Hsiao Huo, Kau-Chu Lin +2 more | 2021-05-11 |
| 10964692 | Through silicon via design for stacking integrated circuits | Kong-Beng Thei, Dun-Nian Yaung, Fu-Jier Fan, Hsing-Chih Lin, Hsiao-Chin Tuan +2 more | 2021-03-30 |
| 10950708 | Dishing prevention dummy structures for semiconductor devices | Yi-Huan Chen, Chien-Chih Chou, Ta-Wei Lin, Fu-Jier Fan, Kong-Beng Thei +1 more | 2021-03-16 |
| 10937785 | Semiconductor device | Kong-Beng Thei, Fu-Jier Fan, Jung-Hui Kao, Yi-Huan Chen, Kau-Chu Lin | 2021-03-02 |
| 10916542 | Recessed STI as the gate dielectric of HV device | Yi-Huan Chen, Kong-Beng Thei, Fu-Jier Fan, Ker Hsiao Huo, Kau-Chu Lin +2 more | 2021-02-09 |