Issued Patents 2021
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211419 | Composite bsi structure and method of manufacturing the same | Wei Chuang Wu, Feng-Chi Hung, Jen-Cheng Liu, Jhy-Jyi Sze, Keng-Yu Chou +3 more | 2021-12-28 |
| 11177307 | Stacked semiconductor dies with a conductive feature passing through a passivation layer | Min-Feng Kao, Jen-Cheng Liu, Hsun-Ying Huang | 2021-11-16 |
| 11152414 | Image sensor including dual isolation and method of making the same | Jeng-Shyan Lin, Jen-Cheng Liu, Chun-Chieh Chuang, Volume Chien | 2021-10-19 |
| 11139367 | High density MIM capacitor structure | Seiji Takahashi, Chen-Jong Wang, Jung-I Lin, Jhy-Jyi Sze, Alexander Kalnitsky +3 more | 2021-10-05 |
| 11121159 | Pixel structure of image sensor having dielectric layer surrounding photo conversion layer and color filter | Tzu-Jui Wang, Keng-Yu Chou, Chun-Hao Chuang, Ming-Chieh Hsu, Ren-Jie Lin +1 more | 2021-09-14 |
| 11114486 | Implant isolated devices and method for forming the same | Min-Feng Kao, Jen-Cheng Liu, Tzu-Hsuan Hsu, Wen-De Wang, Wen-I Hsu | 2021-09-07 |
| 11107767 | Structure for standard logic performance improvement having a back-side through-substrate-via | Min-Feng Kao, Jen-Cheng Liu, Hsun-Ying Huang | 2021-08-31 |
| 11088196 | Metal reflector grounding for noise reduction in light detector | Yen-Ting Chiang, Ching-Chun Wang, Jen-Cheng Liu, Jhy-Jyi Sze, Shyh-Fann Ting +1 more | 2021-08-10 |
| 11088192 | Metal block and bond pad structure | Cheng-Ying Ho, Ching-Chun Wang, Feng-Chi Hung, Yan-Chih Lu | 2021-08-10 |
| 11069736 | Via support structure under pad areas for BSI bondability improvement | Sin-Yao Huang, Ching-Chun Wang, Feng-Chi Hung | 2021-07-20 |
| 11069731 | Apparatus for reducing optical cross-talk in image sensors | Chin-Min Lin, Ching-Chun Wang, Chun-Ming Su, Tzu-Hsuan Hsu | 2021-07-20 |
| 11063038 | Through silicon via design for stacking integrated circuits | Kong-Beng Thei, Fu-Jier Fan, Hsing-Chih Lin, Hsiao-Chin Tuan, Jen-Cheng Liu +2 more | 2021-07-13 |
| 11062977 | Shield structure for backside through substrate vias (TSVs) | Min-Feng Kao, Hsing-Chih Lin, Jen-Cheng Liu, Wei-Tao Tsai | 2021-07-13 |
| 11063080 | Implant damage free image sensor and method of the same | Alexander Kalnitsky, Jhy-Jyi Sze, Chen-Jong Wang, Yimin Huang, Yuichiro Yamashita | 2021-07-13 |
| 11063081 | Device over photodetector pixel sensor | Jhy-Jyi Sze, Alexander Kalnitsky | 2021-07-13 |
| 11043522 | Stacked substrate structure with inter-tier interconnection | Jeng-Shyan Lin, Jen-Cheng Liu, Hsun-Ying Huang, Wei-Chih Weng, Yu-Yang Shen | 2021-06-22 |
| 11037909 | Stacked semiconductor structure and method | Szu-Ying Chen, Meng-Hsun Wan | 2021-06-15 |
| 11037885 | Semiconductor packaging device comprising a shield structure | Wei-Yu Chien, Chien-Hsien Tseng, Nai-Wen Cheng, Pao-Tung Chen, Yi-Shin Chu +1 more | 2021-06-15 |
| 11024602 | Hybrid bond pad structure | Sin-Yao Huang, Chun-Chieh Chuang, Ching-Chun Wang, Sheng-Chau Chen, Feng-Chi Hung +1 more | 2021-06-01 |
| 11011567 | Structure and method for 3D image sensor | Min-Feng Kao, Jen-Cheng Liu, Chun-Chieh Chuang, Feng-Chi Hung, Shuang-Ji Tsai +3 more | 2021-05-18 |
| 11004880 | Semiconductor imaging device having improved dark current performance | Seiji Takahashi, Chen-Jong Wang, Feng-Chi Hung, Feng-Jia Shiu, Jen-Cheng Liu +5 more | 2021-05-11 |
| 10991752 | Vertically integrated image sensor chips and methods for forming the same | Jeng-Shyan Lin, Feng-Chi Hung, Jen-Cheng Liu, Szu-Ying Chen, Wen-De Wang +1 more | 2021-04-27 |
| 10978345 | Interconnect structure for stacked device | Shu-Ting Tsai, Jeng-Shyan Lin, Jen-Cheng Liu, Feng-Chi Hung, Chih-Hui Huang +3 more | 2021-04-13 |
| 10964692 | Through silicon via design for stacking integrated circuits | Kong-Beng Thei, Fu-Jier Fan, Hsing-Chih Lin, Hsiao-Chin Tuan, Jen-Cheng Liu +2 more | 2021-03-30 |
| 10930699 | Method and apparatus for image sensor packaging | Szu-Ying Chen, Meng-Hsun Wan, Pao-Tung Chen, Jen-Cheng Liu | 2021-02-23 |