Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11088192 | Metal block and bond pad structure | Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Yan-Chih Lu | 2021-08-10 |
CH
Cheng-Ying Ho
Overall (2021): #501,336 of 548,734Top 95%
1
Patents 2021