Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11088192 | Metal block and bond pad structure | Cheng-Ying Ho, Dun-Nian Yaung, Feng-Chi Hung, Yan-Chih Lu | 2021-08-10 |
| 11088196 | Metal reflector grounding for noise reduction in light detector | Yen-Ting Chiang, Dun-Nian Yaung, Jen-Cheng Liu, Jhy-Jyi Sze, Shyh-Fann Ting +1 more | 2021-08-10 |
| 11069731 | Apparatus for reducing optical cross-talk in image sensors | Chin-Min Lin, Dun-Nian Yaung, Chun-Ming Su, Tzu-Hsuan Hsu | 2021-07-20 |
| 11069736 | Via support structure under pad areas for BSI bondability improvement | Sin-Yao Huang, Dun-Nian Yaung, Feng-Chi Hung | 2021-07-20 |
| 11024602 | Hybrid bond pad structure | Sin-Yao Huang, Chun-Chieh Chuang, Sheng-Chau Chen, Dun-Nian Yaung, Feng-Chi Hung +1 more | 2021-06-01 |
| 10943940 | Image sensor comprising reflective guide layer and method of forming the same | Wei Chuang Wu, Jhy-Jyi Sze, Yu-Jen Wang, Yen-Chang Chu, Shyh-Fann Ting | 2021-03-09 |