Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11069736 | Via support structure under pad areas for BSI bondability improvement | Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung | 2021-07-20 |
| 11024602 | Hybrid bond pad structure | Chun-Chieh Chuang, Ching-Chun Wang, Sheng-Chau Chen, Dun-Nian Yaung, Feng-Chi Hung +1 more | 2021-06-01 |
| 10991667 | Isolation structure for bond pad structure | Jeng-Shyan Lin, Shih Pei Chou, Tzu-Hsuan Hsu | 2021-04-27 |