Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189583 | Semiconductor structure and manufacturing method thereof | Sheng-Chau Chen, Ming-Che Lee, Kuo-Ming Wu, Cheng-Hsien Chou, Cheng-Yuan Tsai +1 more | 2021-11-30 |
| 11121162 | Light pipe structure with high quantum efficiency | Tsun-Kai Tsao, Jiech-Fun Lu, Tzu-Ming Wang | 2021-09-14 |
| 11049797 | Method for manufacturing a semiconductor structure comprising a semiconductor device layer formed on a tem, porary substrate having a graded SiGe etch stop layer therebetween | Yu-Hung Cheng, Yeur-Luen Tu, Alexander Kalnitsky, Tung-I Lin, Wei-Li Chen | 2021-06-29 |
| 11031434 | Self aligned grids in BSI image sensor | Tsun-Kai Tsao, Jiech-Fun Lu, Wei Chuang Wu | 2021-06-08 |
| 10991667 | Isolation structure for bond pad structure | Sin-Yao Huang, Jeng-Shyan Lin, Tzu-Hsuan Hsu | 2021-04-27 |
| 10978345 | Interconnect structure for stacked device | Shu-Ting Tsai, Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung +3 more | 2021-04-13 |
| 10964746 | Deep trench isolation shrinkage method for enhanced device performance | Cheng-Hsien Chou, Chih-Yu Lai, Sheng-Chau Chen, Chih-Ta Chen, Yeur-Luen Tu +1 more | 2021-03-30 |