Issued Patents 2021
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211259 | Structure and method for embedded gettering in a silicon on insulator wafer | Pu Chen, Shi-Chieh Lin, Victor Lu | 2021-12-28 |
| 11201183 | Image sensor device and method | Yen-Chang Chu, Cheng-Yuan Tsai | 2021-12-14 |
| 11189583 | Semiconductor structure and manufacturing method thereof | Sheng-Chau Chen, Shih Pei Chou, Ming-Che Lee, Kuo-Ming Wu, Cheng-Hsien Chou +1 more | 2021-11-30 |
| 11189515 | Method for alignment, process tool and method for wafer-level alignment | Ching-Hung Wang, Ping-Yin Liu, Yeong-Jyh Lin | 2021-11-30 |
| 11171015 | Multi-layered polysilicon and oxygen-doped polysilicon design for RF SOI trap-rich poly layer | Yu-Hung Cheng, Cheng-Ta Wu, Chen-Hao Chiang, Alexander Kalnitsky, Eugene Chen | 2021-11-09 |
| 11171039 | Composite semiconductor substrate, semiconductor device and method for manufacturing the same | Min-Ying Tsai, Cheng-Ta Wu, Yu-Hung Cheng | 2021-11-09 |
| 11164945 | SOI substrate, semiconductor device and method for manufacturing the same | Cheng-Ta Wu, Kuo-Hwa Tzeng, Chih-Hao Wang, Chung-Yi Yu | 2021-11-02 |
| 11158534 | SOI substrate | Yu-Hung Cheng, Cheng-Ta Wu, Ming-Che Yang, Wei-Kung Tsai, Yong-En Syu +1 more | 2021-10-26 |
| 11101307 | Image sensor having stacked conformal films | Chih-Yu Lai, Min-Ying Tsai, Hai-Dang Trinh, Cheng-Yuan Tsai | 2021-08-24 |
| 11069733 | Image sensor having improved full well capacity and related method of formation | Yu-Hung Cheng, Shyh-Fann Ting, Yen-Ting Chiang, Min-Ying Tsai | 2021-07-20 |
| 11063117 | Semiconductor device structure having carrier-trapping layers with different grain sizes | Yu-Hung Cheng, Yong-En Syu, Kuo-Hwa Tzeng, Ke-Dian Wu, Cheng-Ta Wu +2 more | 2021-07-13 |
| 11049797 | Method for manufacturing a semiconductor structure comprising a semiconductor device layer formed on a tem, porary substrate having a graded SiGe etch stop layer therebetween | Yu-Hung Cheng, Shih Pei Chou, Alexander Kalnitsky, Tung-I Lin, Wei-Li Chen | 2021-06-29 |
| 11037978 | Dual facing BSI image sensors with wafer level stacking | Ping-Yin Liu, Chia-Shiung Tsai, Xiaomeng Chen, Pin-Nan Tseng | 2021-06-15 |
| 10998364 | Image sensor scheme for optical and electrical improvement | Sheng-Chan Li, Cheng-Hsien Chou, Cheng-Yuan Tsai, Keng-Yu Chou | 2021-05-04 |
| 10971534 | Image sensor having improved full well capacity and related method of formation | Yu-Hung Cheng, Shyh-Fann Ting, Yen-Ting Chiang, Min-Ying Tsai | 2021-04-06 |
| 10971406 | Method of forming source/drain regions of transistors | Yu-Hung Cheng, Ching-Wei Tsai, Tung-I Lin, Wei-Li Chen | 2021-04-06 |
| 10964746 | Deep trench isolation shrinkage method for enhanced device performance | Cheng-Hsien Chou, Shih Pei Chou, Chih-Yu Lai, Sheng-Chau Chen, Chih-Ta Chen +1 more | 2021-03-30 |
| 10950631 | Semiconductor-on-insulator wafer having a composite insulator layer | Kuan-Liang Liu | 2021-03-16 |
| 10930547 | Semiconductor structure and manufacturing method thereof | Min-Ying Tsai | 2021-02-23 |
| 10923503 | Semiconductor-on-insulator (SOI) substrate comprising a trap-rich layer with small grain sizes | Yu-Hung Cheng, Cheng-Ta Wu, Min-Ying Tsai, Alex Usenko | 2021-02-16 |
| 10889097 | Wafer debonding system and method | Chang-Chen Tsao, Kuo-Liang Lu, Ru-Liang Lee, Sheng-Hsiang Chuang, Yu-Hung Cheng +1 more | 2021-01-12 |