Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11171015 | Multi-layered polysilicon and oxygen-doped polysilicon design for RF SOI trap-rich poly layer | Yu-Hung Cheng, Cheng-Ta Wu, Chen-Hao Chiang, Alexander Kalnitsky, Yeur-Luen Tu | 2021-11-09 | $17,053,000 |
| 11164844 | Double etch stop layer to protect semiconductor device layers from wet chemical etch | Chen Chen, Ming Chyi Liu | 2021-11-02 | $17,258,000 |
| 11158593 | Structures for bonding a group III-V device to a substrate by stacked conductive bumps | Jhih-Bin Chen, Chia-Shiung Tsai, Ming Chyi Liu | 2021-10-26 | $14,401,000 |