Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211469 | Third generation flash memory structure with self-aligned contact and methods for forming the same | Ming Chyi Liu | 2021-12-28 |
| 11158593 | Structures for bonding a group III-V device to a substrate by stacked conductive bumps | Chia-Shiung Tsai, Ming Chyi Liu, Eugene Chen | 2021-10-26 |
| 11025033 | Bump bonding structure to mitigate space contamination for III-V dies and CMOS dies | Ming Chyi Liu | 2021-06-01 |