Issued Patents 2021
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11167982 | Semiconductor arrangement and formation thereof | Chung-Yen Chou, Lee-Chuan Tseng, Ru-Liang Lee | 2021-11-09 |
| 11158797 | RRAM cell structure with conductive etch-stop layer | Ming Chyi Liu, Yuan-Tai Tseng, Chern-Yow Hsu, Shih-Chang Liu | 2021-10-26 |
| 11158789 | Leakage resistant RRAM/MIM structure | Ming Chyi Liu, Yuan-Tai Tseng, Shih-Chang Liu | 2021-10-26 |
| 11158593 | Structures for bonding a group III-V device to a substrate by stacked conductive bumps | Jhih-Bin Chen, Ming Chyi Liu, Eugene Chen | 2021-10-26 |
| 11152455 | Method to reduce breakdown failure in a MIM capacitor | Hsing-Lien Lin, Chii-Ming Wu, Chung-Yi Yu, Rei-Lin Chu | 2021-10-19 |
| 11056566 | Split gate memory device and method of fabricating the same | Chang-Ming Wu, Wei-Cheng Wu, Shih-Chang Liu, Harry-Hak-Lay Chuang | 2021-07-06 |
| 11037932 | Semiconductor arrangement having capacitor separated from active region | Chern-Yow Hsu, Chen-Jong Wang, Shih-Chang Liu, Xiaomeng Chen | 2021-06-15 |
| 11037978 | Dual facing BSI image sensors with wafer level stacking | Ping-Yin Liu, Yeur-Luen Tu, Xiaomeng Chen, Pin-Nan Tseng | 2021-06-15 |
| 11038010 | Capacitor structure and method of making the same | Jian-Shiou Huang, Cheng-Yuan Tsai, Hsing-Lien Lin, Yao-Wen Chang | 2021-06-15 |
| 11018299 | Memory cell having resistance variable film and method of making the same | Ching-Pei Hsieh, Chern-Yow Hsu, Fu-Ting Sung, Shih-Chang Liu | 2021-05-25 |
| 11011524 | Semiconductor arrangement with capacitor | Chern-Yow Hsu, Chen-Jong Wang, Shih-Chang Liu, Xiaomeng Chen | 2021-05-18 |
| 11005037 | Leakage resistant RRAM/MIM structure | Ming Chyi Liu, Yuan-Tai Tseng, Shih-Chang Liu | 2021-05-11 |
| 10998494 | Perpendicular magnetic random-access memory (MRAM) formation by direct self-assembly method | Chih-Ming Chen, Chern-Yow Hsu, Szu-Yu Wang, Chung-Yi Yu, Xiaomeng Chen | 2021-05-04 |
| 10985090 | Methods of manufacturing a thin film resistor with ends overlapped by interconnect pads | Yuan-Tai Tseng, Chung-Yen Chou, Ming Chyi Liu | 2021-04-20 |
| 10964746 | Deep trench isolation shrinkage method for enhanced device performance | Cheng-Hsien Chou, Shih Pei Chou, Chih-Yu Lai, Sheng-Chau Chen, Chih-Ta Chen +1 more | 2021-03-30 |
| 10962878 | Approach for ultra thin-film transfer and handling | Ping-Yin Liu, Chang-Ming Wu, Xin-Hua Huang | 2021-03-30 |
| 10957852 | Resistance variable memory structure and method of forming the same | Fu-Ting Sung, Ching-Pei Hsieh, Chern-Yow Hsu, Shih-Chang Liu | 2021-03-23 |
| 10937956 | Magnetoresistive random access memory structure and method of forming the same | Chern-Yow Hsu, Wei-Hang Huang, Shih-Chang Liu | 2021-03-02 |