Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211362 | 3D trench capacitor for integrated passive devices | Chung-Yi Yu, Yeong-Jyh Lin, Rei-Lin Chu | 2021-12-28 |
| 11094575 | Simultaneous bonding approach for high quality wafer stacking applications | Ping-Yin Liu, Chang-Chen Tsao | 2021-08-17 |
| 11031369 | Apparatus for bond wave propagation control | Kuan-Liang Liu, Kuo-Liang Lu, Ping-Yin Liu | 2021-06-08 |
| 10962878 | Approach for ultra thin-film transfer and handling | Ping-Yin Liu, Chang-Ming Wu, Chia-Shiung Tsai | 2021-03-30 |