Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11094575 | Simultaneous bonding approach for high quality wafer stacking applications | Xin-Hua Huang, Ping-Yin Liu | 2021-08-17 |
| 10889097 | Wafer debonding system and method | Kuo-Liang Lu, Ru-Liang Lee, Sheng-Hsiang Chuang, Yu-Hung Cheng, Yeur-Luen Tu +1 more | 2021-01-12 |