Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11031369 | Apparatus for bond wave propagation control | Xin-Hua Huang, Kuan-Liang Liu, Ping-Yin Liu | 2021-06-08 |
| 10889097 | Wafer debonding system and method | Chang-Chen Tsao, Ru-Liang Lee, Sheng-Hsiang Chuang, Yu-Hung Cheng, Yeur-Luen Tu +1 more | 2021-01-12 |