Issued Patents 2021
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189515 | Method for alignment, process tool and method for wafer-level alignment | Ching-Hung Wang, Yeong-Jyh Lin, Yeur-Luen Tu | 2021-11-30 |
| 11168682 | Method to determine the reasonable design area of rotor profile of roots pump and its application | Xueming HE, Hainan Huang, Zhenchao Liu, Jiachuan YU | 2021-11-09 |
| 11127725 | Semiconductor structure and associated manufacturing method | Yeong-Jyh Lin, Chi-Ming Chen | 2021-09-21 |
| 11094575 | Simultaneous bonding approach for high quality wafer stacking applications | Xin-Hua Huang, Chang-Chen Tsao | 2021-08-17 |
| 11037978 | Dual facing BSI image sensors with wafer level stacking | Yeur-Luen Tu, Chia-Shiung Tsai, Xiaomeng Chen, Pin-Nan Tseng | 2021-06-15 |
| 11031369 | Apparatus for bond wave propagation control | Xin-Hua Huang, Kuan-Liang Liu, Kuo-Liang Lu | 2021-06-08 |
| 11014805 | Method of forming semiconductor package and semiconductor package | Chun-Wen Cheng, Hung-Chia Tsai, Lan-Lin Chao, Yuan-Chih Hsieh | 2021-05-25 |
| 10962878 | Approach for ultra thin-film transfer and handling | Chang-Ming Wu, Chia-Shiung Tsai, Xin-Hua Huang | 2021-03-30 |