Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211362 | 3D trench capacitor for integrated passive devices | Xin-Hua Huang, Chung-Yi Yu, Rei-Lin Chu | 2021-12-28 |
| 11189515 | Method for alignment, process tool and method for wafer-level alignment | Ching-Hung Wang, Ping-Yin Liu, Yeur-Luen Tu | 2021-11-30 |
| 11127725 | Semiconductor structure and associated manufacturing method | Ping-Yin Liu, Chi-Ming Chen | 2021-09-21 |
| 11024618 | Wafer-level underfill and over-molding | Bor-Ping Jang, Chung-Shi Liu, Chien Ling Hwang | 2021-06-01 |
| 10985135 | Methods for controlling warpage in packaging | Chien Ling Hwang, Bor-Ping Jang, Jen-Chun Liao, Hsiao-Chung Liang, Chung-Shi Liu | 2021-04-20 |