Issued Patents 2021
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211362 | 3D trench capacitor for integrated passive devices | Xin-Hua Huang, Yeong-Jyh Lin, Rei-Lin Chu | 2021-12-28 |
| 11164945 | SOI substrate, semiconductor device and method for manufacturing the same | Cheng-Ta Wu, Kuo-Hwa Tzeng, Chih-Hao Wang, Yeur-Luen Tu | 2021-11-02 |
| 11152455 | Method to reduce breakdown failure in a MIM capacitor | Hsing-Lien Lin, Chii-Ming Wu, Chia-Shiung Tsai, Rei-Lin Chu | 2021-10-19 |
| 11078075 | Packaging method and associated packaging structure | Chih-Ming Chen, Yuan-Chih Hsieh | 2021-08-03 |
| 11047050 | Semiconductor tool having controllable ambient environment processing zones | Chiao-Chun Hsu, Chih-Ming Chen, Sheng-Hsun Lu | 2021-06-29 |
| 10998494 | Perpendicular magnetic random-access memory (MRAM) formation by direct self-assembly method | Chih-Ming Chen, Chern-Yow Hsu, Szu-Yu Wang, Chia-Shiung Tsai, Xiaomeng Chen | 2021-05-04 |
| 10991819 | High electron mobility transistors | Po-Chun Liu, Chi-Ming Chen, Chen-Hao Chiang | 2021-04-27 |
| 10937878 | Method of implanting dopants into a group III-nitride structure and device formed | Han-Chin Chiu, Chi-Ming Chen, Chen-Hao Chiang | 2021-03-02 |
| 10937900 | Semiconductor structure and manufacturing method thereof | Po-Chun Liu, Chi-Ming Chen, Yao-Chung Chang, Jiun-Lei Jerry Yu, Chen-Hao Chiang | 2021-03-02 |